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Additive Metallisation Process for Polyimide Flexible Film & Circuits

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Silver nano-seed layer on Polyimide film using Heriot-Watt Process (2012)
Silver nano-seed layer on Polyimide film using Heriot-Watt Process (2012)

University: Heriot Watt University

Sector(s): Electronics, Sensors & Photonics, Chemical, Electronics, Sensors & Photonics, Information & Communications Technologies, Materials, Nanotechnology, Textiles

About Opportunity:

Additive manufacturing of printed circuits offers many benefits over traditional approaches to circuit manufacture such as less waste, environmental etc. Using visible light and low cost natural photocatalyst materials (Chlorophyll & related natural photosensitisers), Heriot-Watt University researchers have developed a method of producing a conductive seed layer prior to metallising polymer films such as flexible polyimide. The produced seed layer has shown excellent adhesion to Polyimide films with very fine track widths possible depending on exposure process (direct laser writing /exposure masking).

Photo reduction or photo deposition is known within the electronics & circuit industry using high powered UV light sources, organic catalysts and metal salt complexes containing silver, gold, palladium etc.

This is the first demonstration of such a process using visible light and a "nature inspired" catalyst system i.e. Chlorophyll to produce either a conductive film or a seed layer suitable for electroplating.

Published White paper is available on early work in this area - search on "Hhoyd-Gigg Ng, Heriot-Watt".

Key Benefits:

  • Low cost process for creating conductive metallic tracks on Polymer films. 
  • Uses visible light - lowers cost vs UV exposure systems
  • Visible light process = less film damage vs UV
  • Low cost, Nature derived Photocatalyst system -
  • Seed layer produced is compatible with electroless plating solutions (gold/copper etc.)

Applications:

  • Microelectronics - metallisation of flexible films such as Polyimide.
  • Additive processes for the production of circuits on flex/ flex-rigid substrates. 
  • Deposition of Silver Nano-particles in defiend patterns
  • Prototyping of circuit boards, antenna & flex or flex-rigid circuitry.
  • Metallised polyimide fibres for Technical textiles

IP Status: We are seeking commercial partners in the PCB/ Flex circuit industry - Companies with a UK/ Scottish base may be eligible for UK government R&D support to develop the technology in partnership with Heriot-Watt University.

PCT Application (PCT/GB/2012/000116) with a priority date of Feb 2011. Know-How & Process knowledge is being held as trade secret. Process has been demonstrated at "bench level" showing excellent adhesion & conductivity on flexible Polyimide films (sourced from DuPont).

The technology package is available for license or collaborative development in all fields.

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