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University: Heriot Watt University
Sector(s): Electronics, Sensors & Photonics, Information & Communications Technologies, Aerospace, Aviation & Transport
About Opportunity:
Supported by the Scottish Enterprise Proof of Concept Programme, a team at Heriot-Watt university (Edinburgh, Scotland) has developed a wafer level process for bonding or encapsulating MEMS, MOEMS, RF-MEMS or other micro-electronic devies. Using a commercial polymer (BCB from DOW Chemical) and advanced electroplating we provide a composite structure offering greater barrier properties (near hermetic) than polymer only with the added benefit of 3D interconnectivity to reduce device footprint. The finished pacakges can be bonded at low temperatures.
Key Benefits:
Applications:
IP Status:
PCT Patent filing (Sept 2008) for High Barrier Package Designs & background IPR for Laser Assisted Bonding Process for MEMS (2006)White papers available.License is available in all fields of use in combination with know-how in package design processes.
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