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Multi-channel Small Footprint Directly Intergrated Optical Sensors for FBG Sensor Network Interrogation

Electronics, Sensors & Photonics
Electronics, Sensors & Photonics

University: Heriot Watt University

Sector(s): Electronics, Sensors & Photonics, Life Sciences, Construction & Built Environment, Chemical, Information & Communications Technologies, Engineering & Manufacturing, Healthcare & Pharmaceuticals, Aerospace, Aviation & Transport, Environment & Sustainability

About Opportunity:

Using a patent pending manufacturing process we offer high performance FBG network interrogators for applications in Civil engineering, Aerospace and Chemical sensing.

The sensor chips are compact, lighweight and have no moving parts making them highly robust and suited for harsh environment applications (e.g. high pressure/ temperature/ vibration).

Prototype chips operate at 1550nm (product 1) and in visible region (product 2) - a provisional data sheet is available.

Key Benefits:

  • Lightweight, Small Footprint Monolithic design
  • Robust with no moving parts - harsh environments
  • Easily integrated to optical fibers/ FBG networks
  • Precise wavelength analysis with custom design options

Applications:

  • Civil engineering - condition monitoring of bridges, dams etc.
  • Aerospace - real time monitoring of structural flexure
  • Chemistry/ Oil & Gas - robust chemical sensors for harsh environments
  • Biophotonics - cellular studies etc.

IP Status:

Patent applications pending in Laser Processing & Optical Interconnection.Significant know-how & expertise in Optoelectronic systems***Prototypes will be available in April/May 2010 - provisional data sheets available on request ***please visit our site: www.dios.hw.ac.uk Market Potential The DIOS sensing technology offers a small footprint, highly accurate low power alternative to bulky spectrometer based solutions for analysing stress/ strain/ temperature or chemical fingerprint signals from Fiber Sensing Networks across multiple markets. The team now seeks investors and commercial partners/ end users for the technology with a view to forming a spinout targeting identified opportunities around August 2010.further information: www.dios.hw.ac.uk or www.optoscribe.com

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